Director, Back-End Engineering (Semiconductor)

Location: Sagamihara, Japan; onsite fab operations

Company

hirify.global operates a semiconductor fabrication facility producing high-speed laser chips for data centers and AI/ML applications.

What you will do

• Lead the back-end engineering team supporting high-volume laser chip mass production.
• Manage fab operations for production volumes exceeding 20–30 million chips per quarter.
• Set up and improve chip production processes, including test time reduction.
• Drive chip yield improvement and production capacity ramp-up through strategic Kaizen and Capex planning and execution.
• Deploy KPI metrics such as CT, TAKT, and LT to improve back-end production line efficiency.
• Present at business level in English while leading fab and business operations in Japanese.

Requirements

• Bachelor’s, master’s, or PhD degree in electronics, electrical engineering, physics, or a related technical field.
• 20+ years of experience with a bachelor’s degree, 15+ years with a master’s degree, or 10+ years with a PhD.
• Extensive knowledge and experience in back-end technology and/or semiconductor fab operations.
• Fluent Japanese and business-level English for high-level presentations.
• Experience in a manager-level role in semiconductor fabrication, chip design, or process development for semiconductor optical devices.

Culture & Benefits

• Full-time employment in a high-volume semiconductor manufacturing environment.
• Equal opportunity workplace committed to diversity and reasonable accommodation.