Process Integration and Yield Technician (Semiconductor Packaging)

Location: On-site in Chandler or Phoenix, Arizona, United States. The work schedule is 10 hours per day, Sunday–Wednesday or Wednesday–Saturday.

Salary: $51,710–$99,770 USD annually for the US hourly role.

Company

hirify.global develops semiconductor technologies, including advanced electronic packaging and assembly solutions.

What you will do

• Conduct electrical and physical failure analysis for new package technologies.
• Support root-cause investigations related to quality and reliability failures.
• Set up, operate, and maintain laboratory instruments.
• Conduct experiments, make observations, and document results.
• Develop technical conclusions from experimental data.
• Support package material and assembly process development.

Requirements

• Associate or bachelor's degree in materials science, electrical, chemical, or mechanical engineering, or a related field.
• Familiarity with basic scientific principles and laboratory experience.
• At least one year of hands-on project experience on a scientific topic.
• Strong verbal and technical writing skills.
• Ability to work effectively in a team, deliver under pressure, and stay organized.
• Ability to work on-site in Arizona on the stated 10x4 schedule.

Nice to have

• Experience with electrical failure analysis.
• Experience using a mechanical polisher, optical microscope, or electron microscopy equipment.
• Understanding of packaging material properties and behavior.

Culture & Benefits

• Competitive compensation with potential stock bonuses.
• Health, retirement, and vacation benefits.
• Equal employment consideration regardless of legally protected characteristics.
• No recruitment, medical examination, or other hiring fees are charged to candidates.