Principal Application Engineer (Thermal Simulation)

Location: Shanghai, China; onsite customer support is required

Company

hirify.global develops technology solutions and tools for electronic product design and simulation.

What you will do

• Build thermal simulation flows for 2.5D/3D-IC, package, PCB, and electronic products.
• Support customers through onsite engagements, product demonstrations, technical training, and workshops.
• Gather feedback on new application scenarios and challenging thermal problems.
• Collaborate with R&D to improve tool functionality, performance, and competitiveness.
• Establish technical credibility, maintain customer relationships, and ensure high-quality project delivery.

Requirements

• Bachelor’s degree in Thermal Physics, Mechanical Engineering, or a related field; a Master’s degree is preferred.
• 3+ years of experience in thermal simulation, thermal design, or electronic cooling.
• Familiarity with thermal simulation tools.
• Strong teamwork, self-learning, customer orientation, and problem-solving abilities.
• Effective spoken and written English is required.

Nice to have

• Experience with mechanical simulation tools.
• Basic Python or other scripting knowledge for thermal simulation automation.

Culture & Benefits

• Work with customers and R&D teams on challenging thermal simulation problems.
• Contribute to technology improvements and electronic product design workflows.
• Full-time position based in Shanghai.