3DIC Platform Wet and Plating Development Manager (3DIC)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $180,770–$255,200 USD

Company

hirify.global Foundry develops advanced semiconductor manufacturing and packaging technologies, including Foveros Direct, Foveros, and EMIB.

What you will do

• Lead and manage a team of wet etch, wet clean, and plating process engineers.
• Define long-term process roadmaps for 3DIC advanced packaging technologies.
• Oversee production-ready wet etch, clean, and plating processes for high-volume manufacturing.
• Drive yield improvement and defect reduction initiatives across wet etch, clean, and plating modules.
• Develop project schedules, track milestones, and coordinate deliverables across cross-functional teams.
• Partner with process integration and manufacturing operations to transfer technology into high-volume manufacturing.

Requirements

• Master’s degree with 8+ years of relevant experience, or PhD with 6+ years of relevant experience, in chemistry, materials science, physics, electrical engineering, mechanical engineering, or a related field.
• Hands-on experience with wet etch, wet clean, or plating platforms.
• Project management experience, including scheduling, deliverable tracking, and cross-functional collaboration.
• Strong communication, collaboration, strategic thinking, and complex problem-solving skills.
• Experience leading teams and developing technical talent.
• Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

• Vendor relationship management experience, including material quality assessment and performance management.
• Knowledge of Design of Experiments principles and problem-solving methodologies.
• Experience with package interconnect technologies.

Culture & Benefits

• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Focus on inclusive, productive, and innovative team development.
• Opportunity to influence advanced packaging technology roadmaps and next-generation computing solutions.