Staff EMIB-T Substrate Yield Engineer (Advanced Packaging)

Location: Hybrid role based at an hirify.global site in the United States, with an expat assignment in Japan. Primary location: Phoenix, Arizona; additional locations: Albuquerque, New Mexico, and Hillsboro, Oregon.

Annual salary: $180,770–$255,200 USD

Company

hirify.global develops semiconductor technologies and advanced packaging platforms for heterogeneous integration.

What you will do

• Own day-to-day yield performance and technical issue closure for assigned supplier lines, modules, products, and process areas.
• Lead investigations from containment and hypothesis development through experiments, failure analysis, corrective action, and sustainment.
• Use statistical and spatial analytics to identify yield signatures across lines, tools, materials, panel positions, geometries, products, and time.
• Define supplier actions, owners, completion criteria, control limits, and verification plans.
• Support DFM/DFY, qualification, ramp readiness, change control, dashboards, and automated analytics deployment.
• Communicate technical findings, decisions, reusable learning, and residual risks across hirify.global organizations and supplier teams.

Requirements

• Bachelor’s degree with 8+ years of experience, master’s degree with 6+ years, or PhD with 4+ years in engineering, materials science, physics, chemistry, data science, or a related technical discipline.
• At least 5 years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
• Hands-on experience with statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and high-volume manufacturing execution.
• Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification.
• Ability to independently manage complex technical issues, influence cross-functional stakeholders, and drive actions to closure.
• This position is not eligible for hirify.global immigration sponsorship and requires an expat assignment in Japan.

Nice to have

• Experience working directly with substrate suppliers and external manufacturing partners.
• Program leadership experience coordinating cross-functional technical teams in high-impact environments.
• Experience with semi-additive processing, build-up films, microvias, copper plating, lithography, lamination, embedded silicon, TSV, 2.5D/3D packaging, or heterogeneous integration.
• Experience supporting technology development, qualification, and manufacturing ramp of advanced semiconductor technologies.

Culture & Benefits

• Hybrid work model combining on-site work at an assigned hirify.global site with off-site work.
• Competitive pay with stock bonuses.
• Health, retirement, and vacation benefits.
• High-visibility, high-accountability work across hirify.global Foundry Services, hirify.global Product Groups, and substrate suppliers.