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11 дней назад

Mechanical Engineer - Motion Systems (CIP) (PSP) (Semiconductor Manufacturing)

90 000 - 120 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Mechanical Engineer - Motion Systems (CIP) (PSP) (Semiconductor Manufacturing): Designing and validating single-wafer wet processing chambers and related subsystems for next-generation semiconductor manufacturing with an accent on aggressive chemical environments, automation integration, and manufacturability. Focus on thermal and structural FEA, prototype testing, CAD and BOM management, and solving complex design challenges through cross-functional engineering collaboration.

Location: Horsham, Pennsylvania, United States. The role requires up to 10% travel for customer or supplier visits.

Salary: $90,000–$120,000 per year, plus a bonus opportunity.

Company

hirify.global designs, manufactures, and services complex equipment used to produce semiconductor and other digital technologies, including advanced wet processing systems for next-generation devices.

What you will do

  • Design and configure single-wafer wet process chambers and related subassemblies for aggressive chemical environments.
  • Define mechanical specifications and integrate automation, gas, and fluid delivery elements into complete systems.
  • Perform static, dynamic, and thermal finite element analyses and validate designs through hands-on prototype testing.
  • Create and manage SolidWorks or equivalent CAD models, drawings, and bills of materials using PLM tools.
  • Collaborate with Manufacturing, Supply Chain, and Program Management to meet cost, quality, and schedule targets.
  • Present design concepts and risk assessments, support shop-floor builds, and lead design-of-experiments during prototype evaluation.

Requirements

  • Bachelor’s degree in Mechanical Engineering with 5+ years of capital equipment design experience, or a master’s degree with 3+ years of experience.
  • Proficiency in SolidWorks or equivalent 3D CAD and PLM tools; SAP experience is preferred.
  • Experience with structural and thermal finite element analysis.
  • Familiarity with GD&T, motion components, robotics, automation, and SEMI standards.
  • Strong collaboration, technical presentation, problem-solving, prototyping, and troubleshooting abilities.
  • Ability to work in Horsham, Pennsylvania, United States and travel up to 10% for customer or supplier visits.

Nice to have

  • Experience developing chambers or components for chemical process environments.
  • Experience with SAP PLM.

Culture & Benefits

  • Medical, dental, and vision insurance.
  • 401(k) with company match.
  • Holiday, vacation, and sick time.
  • Flexible spending accounts and commuter benefits.
  • Life, accident, disability, emergency travel, and employee assistance benefits.
  • Tuition reimbursement and identity theft remediation.

Hiring process

  • Multiple interviews with several team members, conducted in person or virtually.
  • References or a background investigation may be conducted as part of the offer process.

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