Sr Principal Packaging Engineer (Semiconductor)

Location: Richardson, United States

Salary: $171,000–$296,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

• Define package technology roadmaps and develop packaging solutions for automotive and industrial products.
• Select package materials and bills of materials to meet quality, cost, performance, and manufacturability targets.
• Optimize assembly flows, materials, supplier capabilities, and package cost.
• Develop expertise across QFN, flip-chip, WLCSP, FCBGA, modules, and chiplet packaging architectures.
• Manage supplier and OSAT engagements, including competitive quotes, qualification, and second-source development.
• Lead package co-simulation, feasibility studies, root-cause analysis, corrective actions, and yield improvement from concept through high-volume production.

Requirements

• BS or MS in Electrical Engineering or Mechanical Engineering with more than 15 years of experience in package design and multiple packaging technologies.
• Expertise in flip-chip, WLCSP, FCBGA, modules, chiplets, and related assembly flows.
• Hands-on experience with package- and board-level simulation tools including Cadence, Synopsys, Ansys, and HFSS.
• Strong understanding of package assembly manufacturing flows and reliability standards.
• Experience leading technical engagements with foundry and OSAT partners through development, qualification, and production.
• Ability to lead global cross-disciplinary teams and produce package requirements, architecture specifications, and design documentation.

Culture & Benefits

• Full-time employment within a global semiconductor manufacturing organization.
• Commitment to environmental, health, safety, and security programs.
• Equal opportunity employment and reasonable accommodation support during the hiring process.