Principal Infrastructure Researcher (Advanced Hybrid Bonding)

Location: Veldhoven, Netherlands

Company

hirify.global develops advanced lithography systems and related technologies for semiconductor manufacturing.

What you will do

• Define the infrastructure roadmap and investment strategy for advanced hybrid bonding research.
• Translate technology requirements into equipment specifications and identify future capability gaps.
• Lead the realization of bonding research facilities, laboratory capabilities, and demonstrator environments.
• Define requirements for bonding, cleaning, plasma activation, CMP, wafer handling, process equipment, test vehicles, and process flows.
• Coordinate equipment procurement, installation, qualification, and operational readiness.
• Manage technology partners, suppliers, research institutes, universities, and multidisciplinary stakeholders.

Requirements

• PhD in Semiconductor Processing, Physics, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field, or an MSc with extensive relevant experience.
• Proven experience in semiconductor process development, thin-film processing, advanced packaging, wafer bonding, or related technologies.
• Experience developing and deploying complex laboratory or manufacturing infrastructure.
• Strong understanding of 3D integration.
• Experience working with research institutes, suppliers, and multidisciplinary development teams.
• Legal authorization to access technology controlled under United States Export Administration Regulations is required before starting work.

Culture & Benefits

• Work in an international, multidisciplinary research environment.
• Influence technical direction without formal authority and communicate with specialists, architects, and senior management.
• Collaborate with external research institutes, universities, industrial partners, and equipment suppliers.
• Equal opportunity and inclusive employment environment.