Advanced Packaging Process Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States. The description also references hirify.global's manufacturing campus in Chandler, Arizona. Shift 1, United States of America.

Annual salary: $115,110–$219,550 USD.

Company

hirify.global develops semiconductor technologies and advanced packaging solutions for computing, artificial hirify.globalligence, and autonomous vehicles.

What you will do

• Develop and optimize semiconductor packaging assembly processes and equipment for quality, reliability, yield, and cost targets.
• Design and execute Statistical Process Control and Design of Experiments studies to characterize processes and drive improvement.
• Develop techniques, materials, and tools addressing semiconductor packaging performance and reliability challenges.
• Collaborate with engineering, manufacturing, and product development teams to identify risks and support product launches.
• Establish material and equipment specifications and document technical findings, process improvements, and qualification results.
• Lead standardization of manufacturing systems, equipment setups, and process flows across hirify.global sites.

Requirements

• Master's degree with 3+ years of relevant experience, or PhD in Mechanical Engineering, Physics, Chemistry, or a related STEM field with 1+ years of experience.
• Experience with process development and equipment qualification in a manufacturing environment.
• Experience with data analysis, risk assessment, SPC, DOE, and process characterization.
• Knowledge of semiconductor fabrication, assembly methods, and packaging flows such as flip chip, fan-out, and 2.5D/3D integration.
• Programming experience with Python, MATLAB, or SQL for complex data analysis.
• This position is not eligible for hirify.global immigration sponsorship.

Nice to have

• Experience with quality systems, documentation standards, and packaging reliability evaluation tools.
• PhD-level research experience in a relevant STEM discipline.

Culture & Benefits

• On-site work at a semiconductor manufacturing campus.
• Cross-functional collaboration with engineering, manufacturing, and product development teams.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.