4 дня назад
Senior Engineer, Field Applications (Semiconductor)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Engineer, Field Applications (Semiconductor): Providing technical consultation, application support, and business development for advanced fluid handling and process solutions in semiconductor manufacturing with an accent on customer qualification, process optimization, and advanced packaging applications. Focus on leading product evaluations, troubleshooting root causes, translating customer requirements into product enhancements, and supporting technical engagements across Taiwan and Asia.
Location: Hsinchu City, Taiwan; onsite role with approximately 25–40% travel within Taiwan and Asia
Company
develops advanced fluid handling and process solutions for semiconductor manufacturing applications.
What you will do
- Provide technical consultation and application support for fluid handling products and solutions.
- Work with semiconductor customers to understand process requirements and identify product implementation opportunities.
- Lead product evaluations, qualification activities, troubleshooting, root cause analysis, and technical recommendations.
- Support the development and optimization of fluid management solutions for semiconductor manufacturing processes.
- Translate customer requirements into product enhancements with product engineering and R&D teams.
- Partner with account managers on customer engagement, product launches, market penetration, and business development.
Requirements
- Strong knowledge of semiconductor processes and customer-facing application engineering experience.
- Experience with semiconductor equipment, materials, chemicals, filtration, fluid handling, subsystems, wet clean processes, or advanced packaging.
- Technical communication, presentation, analytical problem-solving, and root cause investigation skills.
- Ability to influence cross-functional teams, manage multiple customer projects, and collaborate with sales, engineering, manufacturing, quality, and product management.
- Fluent written and verbal English and Mandarin are required.
- Ability to travel approximately 25–40% within Taiwan and Asia.
Nice to have
- Experience with wafer carriers or EUV pods.
- Experience with fan-out packaging, 2.5D/3D packaging, TSV, hybrid bonding, micro-bump, wafer-level packaging, or HBM manufacturing processes.
- Experience supporting semiconductor manufacturers such as TSMC, ASE, SPIL, PTI, Powertech, Amkor, Intel, Samsung, or Micron.
Culture & Benefits
- Cross-functional collaboration with global application, engineering, manufacturing, quality, and product teams.
- Regular customer visits, technical reviews, product training, application workshops, and industry conferences.
- Exposure to semiconductor process innovation, emerging technologies, and strategic customer projects.
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