9 дней назад
Product Failure Analysis Engineer (SCAN Design for Test)
141 910 - 269 100$
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Описание вакансии
Текст:
TL;DR
Product Failure Analysis Engineer (SCAN Design for Test) (Semiconductor Manufacturing/DFT): Driving root-cause analysis of silicon failures and improving product quality, yield, reliability, and time-to-market for Intel Foundry 18A products with an accent on DFT, ATPG, scan diagnosis, and physical failure analysis. Focus on isolating microscopic circuit defects, developing debug automation and methodologies, and coordinating corrective actions across design, test, process, and manufacturing teams.
Location: Hillsboro, Oregon, United States; hybrid work model with time split between the site and off-site work
Annual salary: $141,910–$269,100 USD
Company
designs and manufactures advanced semiconductor technologies, including products for personal computing, data centers, AI systems, and autonomous vehicles.
What you will do
- Lead failure analysis investigations using FIB tools, probe tools, automated systems, and other laboratory equipment.
- Apply logical diagnosis and physical failure analysis to isolate silicon defects and identify root causes.
- Collaborate with DFT, design, test, validation, process integration, yield engineering, and high-volume manufacturing teams.
- Develop debug tools, automation frameworks, methodologies, and diagnostic capabilities for advanced technology products.
- Evaluate design-for-debug and physical design issues, implement mitigations, and drive permanent corrective actions.
- Support product quality, yield, reliability, production qualification, and time-to-market for Foundry 18A products.
Requirements
- 6+ years of hands-on semiconductor, product engineering, failure analysis, silicon debug, DFT, yield engineering, or post-silicon validation experience, or an equivalent combination of advanced education and experience.
- Bachelor’s degree in electrical engineering, computer engineering, or a related STEM discipline; master’s or PhD pathways are also accepted with less experience.
- Expertise in DFT tools and techniques, SCAN ATPG methodology, scan chain diagnosis, fault modeling, and scan architecture.
- Experience with ATPG pattern generation, stuck-at, transition, path-delay and bridging faults, and fault-isolation techniques.
- Experience with Siemens Tessent, Synopsys TestMAX/TetraMAX, Verdi, DVE, simulation, and diagnosis tools.
- Experience developing debug automation and analysis tools using Python, Perl, or TCL.
Nice to have
- Experience with JTAG and validation or debug research methodologies.
- Experience developing innovative debug tools in a research-driven environment.
- Experience in foundry, fabless semiconductor, or high-volume manufacturing environments.
Culture & Benefits
- Hybrid work model combining on-site work at the assigned site with off-site work.
- Competitive compensation with stock bonuses.
- Health, retirement, and vacation benefits.
- Cross-functional work focused on advanced semiconductor technology and continuous improvement.
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