Principal Test & Characterization Engineer — Advanced Photonic and Semiconductor Systems

Location: Ulm, Germany; onsite at the Germany-Ulm-LMS13 Office

Company

hirify.global develops large-scale data storage systems and manufacturing technologies for hyperscale data centers, cloud platforms, and enterprise infrastructure.

What you will do

• Develop and operate electrical, optical, and electro-optical characterization platforms for next-generation devices.
• Design experimental setups incorporating optics, motion systems, thermal control, RF instrumentation, imaging, and automated data acquisition.
• Automate complex measurement flows using Python and modern software infrastructure.
• Characterize devices and correlate wafer-level and packaged-device measurements.
• Build scalable data-analysis pipelines, visualization frameworks, and internal productivity tools.
• Apply AI and machine learning to experimental datasets for anomaly detection, trend analysis, classification, and predictive insights.

Requirements

• BS, MS, or PhD in Physics, Electrical Engineering, Photonics, Applied Physics, or a related field.
• At least 5 years of hands-on experimental characterization experience.
• Strong laboratory skills with optics, instrumentation, automation, and measurement systems.
• Strong Python programming and data-analysis capabilities, including automated test systems and instrument control.
• Strong debugging mindset and experimental rigor.
• Ability to work across hardware, software, and data-driven engineering environments.

Nice to have

• Advanced optical or semiconductor device characterization experience.
• AI/ML experience applied to experimental datasets.
• High-speed measurement or RF instrumentation experience.
• Experience building laboratory infrastructure and scaling automated measurement platforms in R&D environments.
• Strong data visualization and analytics capabilities.

Culture & Benefits

• Work in an inclusive environment focused on diversity, belonging, respect, and contribution.
• Collaborate across process, device, packaging, and modeling engineering teams.
• Contribute to real-world storage systems and manufacturing technologies operating at global scale.