Staff Engineer (Die Bond/Wire Bond)

Location: Seremban, Malaysia; onsite

Company

hirify.global is a semiconductor manufacturer operating high-volume backend assembly processes.

What you will do

• Own and sustain Die Attach and Wire Bond processes and equipment on Reel-to-Reel assembly lines.
• Manage tooling setup, calibration, alignment, qualification, and daily production support.
• Conduct DOE, FMEA, root cause analysis, and process capability validation to resolve yield and quality issues.
• Lead new product introduction, product conversion, and material qualification activities.
• Analyze equipment and process data, then drive yield improvement, cost reduction, productivity, and scrap reduction projects.
• Implement digital controls and interlocks, document procedures, and train technicians and operators.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or a related engineering discipline.
• 5–7 years of hands-on Die Bond and/or Wire Bond process and equipment experience in semiconductor backend manufacturing.
• Strong understanding of Reel-to-Reel assembly lines and high-volume production environments.
• Hands-on experience with equipment setup, calibration, troubleshooting, optimization, OEE, yield improvement, and Cpk.
• Knowledge of DOE, FMEA, SPC, 8D, and structured problem-solving methods.
• Ability to analyze manufacturing data using Excel, Spotfire, Power BI, or equivalent tools.

Culture & Benefits

• Cross-functional collaboration with QA, Production, Engineering, and Design teams.
• Technical training and mentoring responsibilities for technicians and operators.
• Inclusive and accessible recruitment process with reasonable adjustments available.
• Employee resource groups, including the Pride Network Group and global and local Women’s groups.