Assistant Engineer (Semiconductor)

Location: Onsite in Krubong, Melaka, Malaysia

Company

hirify.global manufactures discrete semiconductors and passive electronic components for automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical applications.

What you will do

• Support the development and optimization of Die Bond and Wire Bond assembly processes for new product introductions.
• Plan and execute engineering builds, Design of Experiments, and process characterization activities.
• Collect, analyze, and interpret engineering data from process trials and qualifications.
• Prepare technical reports, qualification summaries, and presentations.
• Support the evaluation and qualification of new Die Bond and Wire Bond equipment.

Requirements

• Diploma in engineering, semiconductor technology, microelectronics, mechanical, electrical, electronic, chemical engineering, or science.
• At least 2 years of relevant work experience.
• Basic understanding of semiconductor assembly and packaging processes.
• Knowledge of Die Bond, Wire Bond, SPC, DOE, and problem-solving methodologies.
• Strong analytical, communication, teamwork, and independent-working skills.
• Proficiency in Microsoft Office applications and data analysis tools.

Culture & Benefits

• Health care coverage and financial support programs.
• Open and collaborative work culture.
• Stable business with local and global career opportunities.