Senior Process Engineer (Die Bond)

Location: Penang, Malaysia

Company

hirify.global develops and manufactures optical, photonics, and optoelectronic technologies.

What you will do

• Develop, characterize, optimize, qualify, and sustain high-precision die bond and die attach processes.
• Own process parameters including placement accuracy, bonding force, temperature, time, bond-line thickness, materials, tooling, and collet design.
• Transfer new products from R&D to Contract Manufacturers and support engineering builds, process validation, qualification, and high-volume production ramp-up.
• Create process specifications, work instructions, control plans, process flows, and engineering change records.
• Analyze SPC, yield, capability, and defect data to drive corrective actions, cycle-time reduction, automation, equipment optimization, and cost reduction.
• Lead cross-functional technical projects and mentor junior engineers while working with R&D, Quality, Operations, Supply Chain, suppliers, and Contract Manufacturers.

Requirements

• Bachelor’s degree or higher in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Mechatronics, Physics, Applied Physics, or a related technical field.
• 8+ years of relevant experience for the Senior level or 10+ years with demonstrated technical leadership for the Principal level.
• Hands-on experience with high-precision die bond or die attach processes, preferably laser die-to-submount assembly.
• Experience with optoelectronic devices, optical modules, precision assembly, new product introduction, product qualification, and transfer to high-volume manufacturing.
• Knowledge of SPC, process capability analysis, Cp/Cpk, DOE, statistical data analysis, and structured problem-solving methods including 8D, 5-Why, Fishbone, and fault-tree analysis.
• Good English communication skills and willingness to travel internationally as required.

Nice to have

• Experience with optical communication products, tunable lasers, optical receivers, photonic devices, or related optoelectronic assemblies.
• Experience with ASM, AMICRA, Silicool, Palomar, or equivalent die bond platforms.
• Experience with active and passive alignment, laser attach, submount assembly, precision optical packaging, process automation, equipment integration, tooling design, or collet design.
• Experience working with Contract Manufacturers in international or multi-site manufacturing environments.

Culture & Benefits

• Full-time position supporting optical and photonics manufacturing.
• International collaboration with R&D, Quality, Operations, Supply Chain, equipment suppliers, and Contract Manufacturers.
• Equal opportunity workplace with reasonable accommodation available during the application, interview, and employment process.