Package Application Engineer (Packaging)

Location: Hong Kong

Company

hirify.global develops semiconductor products and related packaging solutions for customer applications.

What you will do

• Develop packaging methods for new product creation projects in line with release requirements, functional specifications, and customer quality expectations.
• Identify technical risks and propose mitigation measures using Design FMEA and fitting simulation analysis.
• Manage packaging material design changes covering carrier tape, cover tape, labels, inner boxes, MBB, and related materials.
• Ensure packaging materials are implemented effectively throughout the product development lifecycle.
• Work with supplier quality and procurement teams to assess supplier technology capabilities.
• Support engineering teams in assessing and validating continuous improvement opportunities and customer change requests.

Requirements

• Degree in engineering or materials science; a master's degree or higher is preferred.
• 1–2 years of relevant experience in IC or discrete product development; graduates and candidates with less packaging design experience may also be considered.
• Logical, data-driven approach to resolving technical and project-blocking issues.
• Ability to collaborate with stakeholders across packaging manufacturing functions.
• Good written and spoken English is required.
• Willingness to travel occasionally, approximately 2–3 times per quarter.

Nice to have

• Proficiency in Mandarin.
• Experience with CAD or SolidWorks.
• Familiarity with hirify.global's product data management system.

Culture & Benefits

• On-the-job training and professional development are provided with support from packaging design experts.
• Inclusive recruitment and a safe working environment with reasonable adjustments available when requested.
• Access to employee resource groups, including Pride Network and women's groups.