Senior Design Engineer/Principal Design Engineer (IC Package Design)

Location: Seremban, Malaysia

Company

hirify.global develops semiconductor package technologies and delivers package R&D capabilities for product creation.

What you will do

• Design new packing methods, footprints, carrier tapes, and boxes based on design requirements and supplier capabilities.
• Own the packing method, footprint, carrier tape, and box design process throughout the development lifecycle.
• Identify technical risks and develop timely mitigation proposals using Design FMEA, simulations, CAD, and other design tools.
• Maintain design rules that reflect assembly and supplier capabilities.
• Address customer physical issues related to T&R, SMT, solderability, packing, and package use.
• Drive technically sound solutions and collaborate with cross-site and cross-functional teams.

Requirements

• Degree in an engineering discipline or materials science; a Master’s degree or higher is preferred.
• Knowledge of IC and discrete package design.
• Experience with simulation, Design FMEA, CAD, and other design tools.
• Experience designing solder footprints is preferred.
• Strong customer focus, proactive working style, ability to work with minimal supervision, and good interpersonal and presentation skills.
• Good command of written and spoken English is required. Willingness to travel occasionally is required; Mandarin is an advantage.

Culture & Benefits

• Work with a Package R&D team enabling new package technologies in the product creation process.
• Participate in cross-site and cross-functional collaboration.
• Join team-building activities that recognize team contributions.
• Work in an inclusive environment with employee resource groups and reasonable workplace adjustments where requested.