Senior Flip-Chip Front-End Packaging Development Engineer (Die Attach & Underfill)

Location: Kuala Lumpur, Malaysia; onsite

Company

hirify.global develops semiconductor technologies and packaging solutions for high-volume manufacturing.

What you will do

• Own and optimize flip-chip front-end die attach and underfill processes, including die placement, bonding, reflow, dispensing, curing, and CSAM controls.
• Lead DOE, process characterization, troubleshooting, root cause analysis, corrective actions, and yield improvement activities.
• Develop new package processes from concept through production release, including process windows, DFM validation, specifications, work instructions, and control plans.
• Lead tooling, fixture, dispense process, and equipment qualification activities with vendors and manufacturing partners.
• Evaluate die attach materials, flux, underfill, and related consumables for manufacturability, reliability, and process performance.
• Act as the technical lead across operations, quality, product engineering, suppliers, and subcontractors while mentoring junior engineers and technicians.

Requirements

• Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related discipline.
• At least five years of experience in semiconductor packaging, with strong exposure to flip-chip front-end die attach and underfill dispensing.
• Hands-on experience in high-volume manufacturing and fast-paced development environments.
• Experience with DOE, 8D, Fishbone, 5-Why, FTA, process characterization, yield improvement, and data-driven troubleshooting.
• Knowledge of underfill inspection and acceptance criteria, including CSAM verification for voids, delamination, non-wet, flow coverage, and cure-related defects.

Nice to have

• Familiarity with the end-to-end flip-chip process flow.
• Experience with AI-based simulation tools.

Culture & Benefits

• Full-time position in an engineering and high-volume manufacturing environment.
• Cross-functional collaboration with operations, quality, product engineering, suppliers, and subcontractors.
• Opportunity to mentor junior engineers and technicians and lead technical improvement initiatives.