Senior Wirebond Process Development Engineer (Semiconductor)

Location: Seremban, Malaysia

Company

hirify.global develops and manufactures semiconductor products and assembly technologies.

What you will do

• Develop and characterize semiconductor assembly process technologies for new products and platforms.
• Drive process development from concept through stable, high-yield manufacturing solutions.
• Provide technical input on assembly processes and equipment, with a focus on wire bond and related front-of-line processes.
• Lead technical discussions, troubleshooting, benchmarking, and technology studies across project teams and sites.
• Apply wafer metallization knowledge and statistical analysis to improve process performance and stability.
• Support internal and external customers with wire bond-related issues and lead cross-site process improvement activities.

Requirements

• Bachelor’s degree in engineering or a related field.
• At least 5 years of experience in semiconductor or manufacturing environments.
• Hands-on experience with wafer dicing, die bonding, plasma, wire bonding, and automated optical inspection processes.
• Strong knowledge of wire bond packaging technologies.
• Experience with Six Sigma methodologies and tools including DOE, SPC, FMEA, 8D, Minitab, or Statistica.
• Fluent English, strong analytical and communication skills, and the ability to work across functions and sites.

Culture & Benefits

• Inclusive and accessible recruitment process with fair consideration for all applicants.
• Safe work environment and reasonable adjustments where requested.
• Employee resource groups, including the Pride Network Group and global and local women’s groups.
• Commitment to increasing women in management positions to 30% by 2030.