Electro-Mechanical Designer (Advanced Packaging)

Location: On-site in Phoenix, Arizona, or Hillsboro, Oregon, United States

Salary: $96,990–$136,920 annual target compensation for an hourly role

Company

hirify.global's posting describes work within Intel Corporation's Product Design Enabling organization, focused on electromechanical design for advanced technology products.

What you will do

• Design PCB test boards, electromechanical devices, components, packaging, and prototypes for Advanced Packaging Technology development.
• Create product and test specifications from technical requirements and participate in design reviews.
• Develop manufacturing drawing packages for PCB and mechanical assemblies using CAD tools.
• Conduct feasibility studies and system simulations to validate functionality, reliability, and safety.
• Select materials, components, and manufacturing technologies for high-volume production designs.
• Plan and execute thermal cycling, dynamic analysis, and functional reliability testing while collaborating with thermal, mechanical, and system engineers.

Requirements

• Associate degree in a related technical field and 8–10 years of hands-on electromechanical design experience.
• Advanced experience with CAD tools for PCB and mechanical assembly design.
• Experience with manufacturing processes, materials selection, and high-volume production environments.
• Expertise developing and executing test plans for functionality validation and reliability assessment.
• Ability to work on-site in Phoenix, Arizona, or Hillsboro, Oregon.

Nice to have

• Bachelor's degree in mechanical engineering, electrical engineering, or a related technical field with 3–6 years of electromechanical design experience.
• Project management experience, including configuration management and change control.
• Experience with dynamic analysis, thermal cycling, system simulations, design previews, and cross-functional issue resolution.

Culture & Benefits

• Collaboration with interdisciplinary thermal, mechanical, and system engineering teams.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Work focused on advanced packaging and next-generation device and system development.