Advanced Packaging Module Development Engineer (Semiconductor)

Location: On-site in Hillsboro, Oregon, United States

Salary: $133,800–$255,200 annual USD

Company

hirify.global is a semiconductor company developing and manufacturing advanced chips, computing technologies, and connectivity solutions.

What you will do

• Drive process integration, technology development, and enablement for high-volume manufacturing and future semiconductor technology nodes.
• Design and develop manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform pathfinding and develop technology roadmaps for future device architectures and product generations.
• Optimize manufacturing equipment and processes to improve efficiency, production techniques, and output.
• Collaborate with equipment and materials suppliers on technology development and cost-sensitive roadmaps.
• Conduct feasibility studies, simulations, statistical analysis, experiments, and automation development using robotics, vision systems, and image processing.

Requirements

• Master’s degree in materials science and engineering, mechanical engineering, chemical engineering, electrical engineering, physics, chemistry, or a related field with 4+ years of relevant industry experience; or a PhD in one of these fields with 3+ years of relevant experience.
• Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Hands-on experience with robotics, automation systems, vision systems, or image processing.
• Ability to apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Programming experience in Python or MATLAB and experience troubleshooting complex manufacturing processes and equipment.
• Ability to work on-site at the Hillsboro, Oregon campus.

Nice to have

• Experience with packaging processes, equipment automation development, or project management.
• Knowledge of semiconductor device physics and advanced packaging technologies.

Culture & Benefits

• Collaborative environment involving engineering teams, leadership, and external suppliers.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Inclusive workplace with equal employment consideration.