Thermal Analysis Engineer (Semiconductor)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $164,470–$232,190 USD

Company

hirify.global develops semiconductor technologies, assembly and packaging platforms, and advanced interconnect solutions.

What you will do

• Conduct research in device physics, thermomechanical analysis, materials science, and semiconductor process innovation.
• Design and fabricate prototypes for advanced packaging and interconnect technologies, including EMIB and Foveros architectures.
• Perform electrical testing and establish characterization methods for DC, RF signals, pulsing, and stressing.
• Develop process solutions across lithography, etch, diffusion, CVD, PVD, and CMP production modules.
• Plan experiments with device, reliability, and fabrication teams and benchmark results against industry standards.
• Develop models and measurements, collaborate with external vendors and researchers, and support hirify.global's research pipeline.

Requirements

• Bachelor's degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
• 6+ years of experience with a bachelor's degree, 4+ years with a master's degree, or 2+ years with a PhD.
• Advanced experience with semiconductor fabrication, packaging design methodologies, and advanced packaging technologies.
• Advanced experience with Ansys or Abaqus for finite element analysis and computational fluid dynamics.
• Programming experience in Python or MATLAB for engineering applications.
• Hands-on experience with experimental setups, data analysis, Design of Experiments, statistical analysis, technical leadership, and mentoring.

Culture & Benefits

• Cross-disciplinary collaboration with device, reliability, fabrication, academic, and external research teams.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Shift 1 schedule in the United States.