Package Design Electrical Engineer (Semiconductors)

Location: Austin (Oakhill, Office), United States; onsite

Company

hirify.global develops scalable, cost-competitive semiconductor technologies and IC packaging solutions for applications ranging from power management to radar and 6G.

What you will do

• Develop optimized package design solutions for new product and technology introductions.
• Define packages that meet electrical performance, manufacturability, and cost requirements.
• Run electromagnetic modeling tools and document simulation results.
• Collaborate with SoC, PCB, and package layout teams to improve IO interfaces, signal integrity, and power performance.
• Provide package electrical data and models for business-line system-level simulations.

Requirements

• MSEE or higher degree with experience in microelectronics packaging design, electromagnetic modeling, or a related field.
• Proficiency with electromagnetic modeling and simulation tools such as HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, or Cadence signal and power integrity tools.
• Understanding of semiconductor IO interfaces such as LVDS, DDR, and SerDes.
• Strong written, verbal, and presentation communication skills.
• Ability to work proactively in a dynamic environment and collaborate with engineering and management teams.

Nice to have

• RF design and multiple-GHz wired or wireless modeling experience.
• Antenna modeling experience.
• PCB design experience or collaboration with PCB designers.
• Knowledge of die-level Back End of Line design.

Culture & Benefits

• Work in a globally and locally collaborative engineering environment.
• Contribute to package technologies supporting advanced analog, RF, automotive, connectivity, security, and edge-processing products.
• Work on package solutions spanning frequencies from DC to over 100 GHz and designs ranging from several pins to thousands of IOs.
• Equal opportunity employment and reasonable accommodations for qualified individuals with disabilities.