Advanced Package Design Senior Staff Engineer (Semiconductor Packaging)

Location: Santa Clara, CA, United States

Expected base pay: $141,150–$211,400 per annum

Company

hirify.global develops semiconductor solutions for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Develop advanced microelectronic packaging solutions for next-generation semiconductor products supporting 448 Gb/s data rates and beyond.
• Lead package development and electrical design, including floorplanning, netlist creation, and BGA map definition.
• Optimize signal integrity, power integrity, performance, manufacturability, reliability, and cost.
• Evaluate package technologies and drive layout implementation with package operations teams.
• Define package requirements and achievable specifications with marketing, system architecture, and IC design teams.
• Advance packaging technologies from concept through product development and production.

Requirements

• Bachelor’s degree in Computer Science, Electrical Engineering, or a related field with 7+ years of relevant experience, or a Master’s degree and/or PhD with 5+ years of experience.
• Experience with high-speed electronic packaging for digital and analog ICs, package floorplanning, netlists, schematics, and BGA maps.
• Experience with 2.5D/3D package development and knowledge of packaging materials, substrate design rules, and assembly rules.
• Strong fundamentals in electromagnetics, transmission lines, and microwave theory, with experience using 2D/3D EM simulation tools.
• Experience with tools such as Ansys HFSS, SI-Wave, Cadence Clarity, PowerSI, or similar package and power-integrity tools.
• Ability to collaborate across IC layout, analog and digital design, SI/PI, thermal-mechanical, assembly, and marketing teams; strong communication and documentation skills.

Nice to have

• Experience with CPC/CPO connectors.
• Experience with Integrated System Planner, APD, and Python scripting for SI, PI, and packaging automation.
• Track record of new product introduction from concept through production.

Culture & Benefits

• Employee stock purchase plan with a two-year look-back.
• Bonus and equity plans, including new-hire equity grants and annual equity refreshers.
• Family support programs and mental health resources.
• Recognition and service awards.
• Export-controlled technology access may require eligibility under U.S. regulations and an export license review.

Hiring process

• Interviews evaluate individual experience, thought process, and communication skills.
• AI tools, transcription apps, automated answer generators, and automated note-taking bots are not permitted during interviews.