Senior Thin Films Metals Deposition Engineer (Semiconductor Manufacturing)

Location: Hillsboro, Oregon, United States; hybrid work model with regular on-site work at the assigned hirify.global site and in-person collaboration.

Annual salary: $133,800–$255,200 USD.

Company

hirify.global develops semiconductor technologies and operates advanced technology development and high-volume manufacturing organizations.

What you will do

• Enable process performance and manufacturability for advanced metals deposition modules across hirify.global 18A, hirify.global 3, and hirify.global 12nm technology nodes.
• Transfer new technologies from development into high-volume manufacturing and support technology ramp and sustaining operations.
• Own data-driven root cause analysis and resolution of technical, yield, variation, and manufacturing challenges.
• Define technical strategies, process solutions, and team goals while removing execution roadblocks.
• Collaborate with technology development, manufacturing, integration, device, yield, metrology, quality, reliability, business, and supplier stakeholders.
• Drive rapid execution and in-person decision-making to deliver process solutions on challenging schedules.

Requirements

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering or science field.
• 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
• 4+ years of direct experience with metals deposition modules and 3+ years with PVD, CVD, and/or ALD technologies.
• Hands-on experience with thin-film deposition for frontend, middle-of-line, backend metals, interconnects, or conductive and barrier/liner films.
• Experience with module integration and interactions with CMP, lithography, etch, and clean processes, including effects on device performance and yield.
• Ability to analyze data, communicate technical information clearly, lead cross-functional work, and manage complex assignments under deadline pressure.

Nice to have

• Ph.D. in a relevant engineering or science field.
• Experience with advanced technology nodes, including 10nm-class and below technologies or comparable leading-edge foundry nodes.
• Experience with contact/MOL metals, BEOL/Cu interconnects, liners, barriers, adhesion layers, or conductive films.
• Experience with interconnect and MOL physics, process window characterization, tool matching, and transfer from technology development to high-volume manufacturing.
• Experience qualifying and releasing multi-chamber PVD, CVD, or ALD equipment and collaborating with equipment and materials suppliers.

Culture & Benefits

• Hybrid work model combining on-site work at the assigned hirify.global site with off-site work.
• In-person collaboration is expected to support faster decision-making and problem resolution.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Work in a technology manufacturing organization focused on process capability, continuous improvement, and predictable silicon delivery.