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10 дней назад

Senior Process Development Engineer (IBD)

113 000 - 145 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Process Development Engineer (IBD) (Semiconductor Thin Films): Developing advanced thin-film processes and applications for ion beam deposition and etch technologies with an accent on process integration, experimentation, and materials characterization. Focus on designing experiments, analyzing complex thin-film data, developing process-control methods, and translating customer requirements into equipment upgrades and applications.

Location: Plainview, New York, United States; onsite role with up to 30% domestic and international travel

Salary: $113,000–$145,000 per year, plus bonus opportunity

Company

hirify.global designs, develops, manufactures, and services advanced equipment used by technology companies to produce semiconductor and other digital devices.

What you will do

  • Lead process and application development using ion beam deposition and etch technologies.
  • Develop advanced thin-film processes aligned with current and future customer requirements.
  • Design experiments, execute process studies, and analyze data.
  • Develop and maintain best known methods for process control, process development, and continuous improvement.
  • Act as a technical expert for customers and support technical partnerships with Sales and Marketing.
  • Define process specifications and coordinate new equipment upgrades and hardware development with Engineering.

Requirements

  • Master’s degree with at least 6 years of experience, or PhD with at least 3 years of experience, in Physics, Materials Science, or a related field.
  • Process development experience and expertise in vacuum thin-film technology.
  • Expertise in semiconductor thin-film technologies and knowledge of semiconductor devices and module processes.
  • Process integration experience in logic and/or memory fabrication.
  • Experience with thin-film characterization techniques, including four-point probe, stress measurements, ellipsometry, spectroscopy, XRD/XRR, and depth profiling.
  • Ability to travel up to 30% domestically and internationally, with strong communication and collaboration skills.

Nice to have

  • Experience with metal thin films.
  • Experience analyzing TEM, EBSD, EELS, and XPS characterization data.

Culture & Benefits

  • Medical, dental, and vision insurance.
  • 401(k) with company match and employee stock purchase plan.
  • Holiday, vacation, and sick time.
  • Flexible spending accounts and commuter benefits.
  • Tuition reimbursement, disability insurance, life and accident insurance, and employee assistance support.

Hiring process

  • Multiple interviews with several team members, conducted in person or virtually.
  • References or a background investigation may be completed before an offer.

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