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1 день назад

Device Compact Modeling Engineer (2027 New College Graduate) (SPICE)

58 400 - 100 800$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Device Compact Modeling Engineer (2027 New College Graduate) (SPICE): Developing digital, analog, and RF compact device models for GF CMOS technologies with an accent on model extraction, validation, QA, and circuit benchmarking. Focus on coordinating cross-functional modeling projects, resolving technical issues, and delivering accurate production-ready models for internal and external customers.

Location: Malta, New York, USA

Salary: $58,400–$100,800 per year

Company

hirify.global manufactures essential semiconductors and develops power-efficient, high-performance solutions for technology markets including AI.

What you will do

  • Develop SPICE compact models for digital, analog, and RF devices in GF CMOS technologies.
  • Establish best practices for data selection, model extraction, QA, validation, and circuit benchmarking.
  • Coordinate with device modeling, characterization, PDK, device engineering, process integration, design manual, and test chip design teams.
  • Apply current SPICE modeling methodologies and innovative techniques to development flows.
  • Communicate project progress and provide technical updates to stakeholders.
  • Support customers with compact model questions, investigations, and issue resolution.

Requirements

  • Bachelor’s degree in Electrical Engineering, Physics, or a related field, with graduation expected in 2027.
  • Overall GPA of at least 3.0 and good academic standing.
  • Written and verbal English fluency required.
  • Fundamental knowledge of semiconductor device physics and compact modeling for different device types.
  • Understanding of semiconductor device noise and matching behavior.

Nice to have

  • Related internship or co-op experience.
  • Experience with analog or RF design flows and methodologies.
  • Coding experience in Python, Perl, or other programming languages.
  • Experience with machine learning, artificial intelligence, SPICE model generation, QA flows, or test structure layout.
  • Leadership, project management, communication, planning, and organizational skills.

Culture & Benefits

  • Full-time employment with accelerated training in a fast-paced environment.
  • Cross-functional collaboration and talent mobility opportunities.
  • Mentorship, networking, and leadership development opportunities for new graduates.
  • Participation in a workplace focused on security, longevity, sustainability, and safety.

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