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6 дней назад

Principal Engineer, Silicon Photonics Assembly (Silicon Photonics)

168 400 - 249 310$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Engineer, Silicon Photonics Assembly (Silicon Photonics): Developing and qualifying advanced assembly technologies for silicon photonics and co-packaged optics products with an accent on optical engine and connector attach processes, package integration, and design for manufacturability. Focus on leading process characterization and DOE, collaborating with OSATs and suppliers, and solving complex assembly and reliability challenges from technology evaluation through product qualification.

Location: Westlake Village, California, United States

Salary: $168,400–$249,310 per year base pay

Company

hirify.global develops semiconductor solutions and data infrastructure technologies for enterprise, cloud, AI, and carrier architectures.

What you will do

  • Develop and qualify assembly technologies for silicon photonics and co-packaged optics products.
  • Develop optical engine and connector attach processes.
  • Lead process development, characterization, and design of experiments to establish assembly capabilities and process windows.
  • Collaborate with OSATs, equipment suppliers, material vendors, and cross-functional engineering teams.
  • Drive root-cause analysis and resolution of assembly and reliability challenges.
  • Provide technical leadership from technology evaluation through prototype build and product qualification.

Requirements

  • M.S. or Ph.D. in Materials Science, Packaging Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field.
  • 10+ years of experience in advanced packaging, semiconductor assembly, or technology development.
  • Experience developing and qualifying advanced package assembly technologies for complex semiconductor products.
  • Strong expertise in assembly process development, package integration, and design for manufacturability.
  • Experience working with OSATs, equipment suppliers, and cross-functional engineering teams.
  • Applicants must be eligible to access export-controlled technology and software under U.S. export control laws; an export license review may be required.

Nice to have

  • Optical module integration and co-packaged optics experience.

Culture & Benefits

  • Full-time employment with eligibility for bonus and equity plans.
  • New hire equity grants and annual equity refreshers.
  • Employee stock purchase plan with a two-year lookback.
  • Family support programs and mental and physical health resources.
  • Recognition and service awards.

Hiring process

  • Interviews evaluate individual experience, thought process, and communication skills.
  • AI tools, transcription apps, automated answer generators, and automated note-taking bots are not permitted during interviews.

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