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6 дней назад

Femtosecond Laser Manufacturing Engineer (Semiconductor)

136 200 - 178 815$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Femtosecond Laser Manufacturing Engineer (Semiconductor): Developing and sustaining precision femtosecond laser manufacturing processes for ceramic, advanced-material, and next-generation semiconductor products with an accent on sub-micron micromachining, laser recipe optimization, and process automation. Focus on qualifying processes, analyzing SPC and metrology data, supporting NPI and production ramp, and improving yield, cycle time, and manufacturing cost.

Location: Livermore, California, United States; onsite day shift

Salary: $136,200–$178,815 per year

Company

hirify.global provides test and measurement technologies for the semiconductor product life cycle, serving customers through facilities in Asia, Europe, and North America.

What you will do

  • Develop, optimize, and sustain femtosecond laser manufacturing processes for semiconductor products.
  • Create high-precision micromachining processes for ceramic and advanced materials with micron and sub-micron accuracy.
  • Optimize laser parameters, recipes, scanning strategies, beam alignment, and process automation.
  • Support process qualification, validation, equipment installation, production ramp, troubleshooting, and NPI activities.
  • Use SPC, process capability analysis, manufacturing data, and metrology results to improve yield, repeatability, cycle time, and cost.
  • Create engineering documentation, support engineering changes, train technicians and operators, and lead cross-functional improvement projects.

Requirements

  • Bachelor’s degree in mechanical, manufacturing, electrical, materials, physics, photonics, optical engineering, or a related discipline; equivalent experience may be considered.
  • At least 8 years of related experience with a bachelor’s degree, 6 years with a master’s degree, or 3 years with a PhD.
  • Experience in semiconductor manufacturing and hands-on femtosecond laser processing.
  • Experience with precision laser micromachining of ceramic or advanced materials and laser-material interaction.
  • Knowledge of SPC, DOE, process capability analysis, root cause analysis, and technical troubleshooting.
  • Ability to create work instructions, FMEAs, process specifications, manufacturing procedures, and validation documentation.

Culture & Benefits

  • Cross-functional collaboration with Product Engineering, Wafer Engineering, Manufacturing, Quality, and Equipment Engineering.
  • Medical, dental, vision, life insurance, and disability coverage.
  • 401(k) with company match and employee stock purchase plan.
  • Paid time off, flexible spending or savings accounts, and quarterly profit-sharing bonuses.

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