Advanced Packaging Process Engineer III (E3) (Semiconductor Packaging)

Location: Santa Clara, California, United States; travel required up to 10% of the time. Relocation eligible.

Salary: $124,000–$171,000 per year

Company

hirify.global develops materials science and engineering solutions for semiconductor chips and advanced displays.

What you will do

• Design experiments, collect and analyze data, and prepare technical reports.
• Characterize hardware and measure film properties across complex systems.
• Troubleshoot process engineering issues, perform root cause analysis, and implement solutions.
• Develop internal product documentation, presentations, and technical materials.
• Engage with customers to resolve complex process engineering concerns.
• Partner with vendors and suppliers, implement new technologies and instrumentation, and lead project teams when needed.

Requirements

• Bachelor’s or master’s degree in electrical, chemical, or mechanical engineering, materials science, physics, or a related field.
• 4–7 years of related experience and demonstrated expertise in complex problem solving.
• Experience with electronic packaging fabrication, including W2W and D2W bonding.
• Hands-on experience operating tools and developing processes in the PCB or semiconductor industry.
• Ability to communicate with customers and work with limited supervision.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs with a comprehensive benefits package.
• Regular employee position with potential eligibility for bonus and stock awards.
• Opportunity to work on technologies supporting AI and next-generation semiconductor chips.