Application Engineer (Semiconductor)

Location: Chitose, Hokkaido, Japan; on-site support is required. Clean room work may be required from time to time.

Company

hirify.global develops semiconductor manufacturing systems and provides engineering solutions for advanced chip production.

What you will do

• Analyze overlay and imaging data for Node Transition Projects.
• Connect analysis results to suitable technical solutions and support customer product issues through resolution.
• Collaborate with overlay and imaging expert engineers at headquarters.
• Present technical analysis results and lead technical discussions with internal and external customers.
• Support engineering activities for EUV, DUV, YS, and VCP.
• Act as the local project lead by driving workstreams, coordinating schedules, and managing internal and external reporting.

Requirements

• Bachelor’s degree or higher in physical sciences, optics, electrical engineering, chemical engineering, materials science, mathematics, or a related field.
• More than 2 years of experience in the semiconductor industry.
• More than 1 year of project lead experience.
• Strong data analysis, troubleshooting, reporting, problem-solving, and project management skills.
• Experience with Microsoft Excel and PowerPoint and the ability to create user-friendly technical documentation.
• Daily conversational English with TOEIC above 600 and daily conversational Japanese or higher are required.

Culture & Benefits

• Work with internal and external stakeholders on customer-focused semiconductor engineering projects.
• Regular collaboration with headquarters-based technical experts.
• On-site work in a semiconductor manufacturing environment, including occasional clean room work.
• Access to controlled technology requires legal authorization under United States Export Administration Regulations before starting work.
• hirify.global is committed to an inclusive and diverse workforce and provides equal employment opportunities.