Principal Hardware Application Engineer (High-Speed Networking)

Location: Taipei, Taiwan

Company

hirify.global develops semiconductor solutions for enterprise, cloud, AI, carrier, and data infrastructure systems.

What you will do

• Serve as the primary hardware technical focal point for strategic customer accounts and drive design-in activities from schematic review through mass production.
• Review customer schematics and PCB layouts, providing guidance on component selection, power sequencing, clock distribution, and high-speed signal routing.
• Perform or coordinate signal integrity and power integrity simulations for 800G, 1.6T, and next-generation Ethernet interfaces.
• Support board bring-up and debug at customer sites and in the Taipei lab, including SerDes training, power integrity, thermal, and interface issues.
• Create hardware design guides, application notes, schematic checklists, and layout guidelines.
• Collaborate with global hardware, SI/PI, software, silicon, platform, and supply-chain teams while exploring UALink, ESUN, CPO, and 224G SerDes technologies.

Requirements

• Bachelor’s degree or higher in Electrical Engineering, Electronics Engineering, or a related field.
• 8+ years of experience in hardware design or hardware application engineering for high-speed networking or data-center systems.
• Proficiency with schematic capture and PCB layout review tools such as OrCAD, PADS, or Allegro.
• Strong knowledge of signal integrity, channel loss, eye diagrams, SerDes Tx/Rx equalization, PAM4 link budgets, power integrity, PDN design, decoupling, and power sequencing.
• Experience supporting customers through schematic review, layout review, board bring-up, and EDVT.
• Strong technical communication skills and the ability to manage multiple customer engagements in parallel.

Nice to have

• Experience with DC switch or high-speed Ethernet platforms, including 400G, 800G, or 1.6T designs.
• Knowledge of hirify.global Teralynx or equivalent data-center switch silicon.
• Experience with Sigrity, Ansys SIwave, HFSS, PowerDC, oscilloscopes, VNAs, BERTs, or real-time sampling scopes.
• Knowledge of thermal design, next-generation interconnects, and Taiwan’s ODM and component supply-chain ecosystem.

Culture & Benefits

• Collaborative environment with global engineering and cross-functional teams.
• Competitive compensation and benefits.
• Eligibility for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Resources for professional growth and development.
• Interviews prohibit the use of AI tools unless expressly permitted by the interviewer.