Substrate Packaging Research and Development Engineer

Location: Hybrid role based at the assigned site in Phoenix, Arizona, United States, with time split between onsite and offsite work.

Annual salary: $133,800–$188,890 USD.

Company

Develops semiconductor technologies and next-generation substrate packaging solutions for high-performance and mobile computing applications.

What you will do

• Develop and optimize advanced packaging processes, materials, and equipment for reliability, quality, cost, and efficiency targets.
• Design process specifications, workflows, and equipment configurations for new packaging technologies.
• Conduct design of experiments to characterize process windows and interactions between equipment, materials, and chemistry.
• Drive continuous improvement of process capability, stability, productivity, and equipment performance.
• Collaborate with cross-functional teams and suppliers to resolve technical challenges and establish material specifications.
• Document process innovations through technical reports and white papers while providing sustaining support in high-volume manufacturing.

Requirements

• PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a similar engineering discipline.
• At least 1 year of related experience.
• Experience combining engineering judgment and data analysis to draw conclusions, build models, and design experiments.
• Knowledge of materials science, materials engineering, and material characterization techniques.
• Knowledge and experience with design of experiments, statistical data analysis, and statistical process control.
• Ability to work in a hybrid model with onsite presence at the assigned United States site in Phoenix, Arizona.

Nice to have

• Working knowledge or prior experience with optics and lasers.
• Experience in laser micromachining and microfabrication.

Culture & Benefits

• Cross-functional collaboration and ownership of technical problem-solving.
• Work on evolving semiconductor packaging technologies in a high-volume manufacturing environment.
• Health, retirement, and vacation benefits.
• Competitive pay, stock bonuses, and a total compensation package.