Advanced Packaging Metrology Engineering Manager (Semiconductor)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $155,520–$255,200 USD

Company

A global technology company developing semiconductor and advanced packaging technologies.

What you will do

• Lead engineers developing advanced wafer processing and wafer-level packaging solutions.
• Drive technology enablement, feasibility studies, module improvements, and manufacturing readiness.
• Demonstrate manufacturing capabilities at high volumes and transfer technologies to global manufacturing sites.
• Partner with integration, device, yield, and supplier teams to optimize safety, quality, cost, and device performance.
• Define long-term module engineering strategies and measurable team objectives.
• Coach and develop engineers in technology road mapping, process development, and future innovation.

Requirements

• Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; or a master’s degree with 4+ years; or a PhD with 4+ years.
• Experience in semiconductor wafer or assembly processes, equipment, materials development, process development methodology, project management, or schedule-based execution.
• Experience in metrology, engineering management, wafer-level assembly or packaging research and development, and semiconductor process development leadership.
• Ability to lead programs from strategy formation through high-volume production.
• Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

• Experience with hybrid bonded interconnects, redistribution layer packaging, and ultra-fine pitch solder connections.

Culture & Benefits

• Collaborative, inclusive, and psychologically safe work environment.
• Competitive pay with stock bonuses.
• Health, retirement, and vacation benefits.
• Focus on accountability, innovation, mentoring, and diversity of thought.