6 дней назад
Graphene Process Development & Innovation Engineer (Semiconductor)
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Graphene Process Development & Innovation Engineer (Semiconductor): Developing and integrating graphene transfer, lamination, patterning, and wet processes for next-generation IGP™ devices with an accent on scalable process flows, equipment qualification, and manufacturing readiness. Focus on optimizing wafer handling and wet-processing equipment, establishing process windows, analyzing process data, and solving complex integration and yield challenges during fab startup and production ramp-up.
Location: On-site in Aachen, Germany
Company
develops graphene photonic solutions that connect chips into high-throughput, low-delay, and energy-efficient computing networks.
What you will do
- Lead the development and optimization of graphene transfer, lamination, handling, patterning, and wet processes for next-generation IGP™ devices.
- Develop scalable process flows from R&D through qualification, fab startup, manufacturing ramp-up, and sustained production.
- Integrate and qualify equipment for graphene transfer, wafer mounting, tape application, wafer handling, and wet processing.
- Define equipment specifications, process capabilities, automation requirements, recipes, process windows, and control plans.
- Use DOE, process characterization, SPC, metrology, and inspection data to improve yield, quality, throughput, reliability, and cost of ownership.
- Lead root-cause analysis, corrective actions, technical collaboration, and knowledge transfer from R&D into manufacturing.
Requirements
- Master’s or Ph.D. degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Mechatronics, Physics, Semiconductor Engineering, or a related field; equivalent experience may be considered.
- At least 3 years of experience in semiconductors, advanced materials, advanced packaging, wafer processing, or related manufacturing.
- Experience with graphene or 2D-material processing and integration, graphene transfer and handling, wafer lamination, mounting, tape application, or thin-wafer handling.
- Experience with wet and chemical processing, advanced packaging, wafer-level manufacturing, or semiconductor equipment development and integration.
- Ability to collaborate with process integration, device, equipment, facilities, metrology, manufacturing, quality, R&D, and external technology partners.
Culture & Benefits
- Flexible, human-centric working culture focused on work-life harmony.
- Autonomy and continuous learning opportunities supporting professional and personal development.
- Benefits package including insurance, pension, and virtual stock options.
- Open and inclusive environment focused on collaboration, innovation, and growth.
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