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1 день назад

Principal Physical Design Engineer (AI)

250 000 - 400 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Principal Physical Design Engineer (AI hardware): Leading end-to-end physical implementation of critical blocks for a high-performance AI accelerator SoC with an accent on floorplanning, place and route, timing closure, power optimization, and signoff. Focus on developing AI-assisted implementation methodologies, solving advanced-node ASIC challenges, and bringing first-generation silicon through tapeout.

Location: San Francisco Bay Area, Mountain View, CA, Greater Boston, or San Jose, CA

Salary: $250,000–$400,000 per year

Company

hirify.global is partnering with a well-funded, early-stage AI hardware startup developing a next-generation inference platform that combines custom silicon with integrated software and systems engineering.

What you will do

  • Own the complete physical design flow for major SoC blocks from floorplanning through final signoff.
  • Drive place and route, clock tree synthesis, timing closure, power optimization, and physical verification.
  • Develop AI-assisted implementation methodologies to improve productivity and accelerate tapeout schedules.
  • Collaborate with architecture, RTL, verification, and software teams to optimize performance, power, and area.
  • Work with EDA vendors and foundry partners to resolve implementation challenges and deliver production-ready silicon.

Requirements

  • 8+ years of experience in physical design for complex, high-performance ASICs at advanced process nodes of 7nm or below.
  • Deep expertise in synthesis, place and route, clock tree synthesis, timing closure, physical verification, and signoff.
  • Hands-on experience with Cadence Innovus, Synopsys Fusion Compiler, or comparable implementation platforms.
  • Experience with PrimeTime, Tempus, or equivalent industry-standard signoff tools.
  • Proven ability to work cross-functionally with architects, RTL engineers, EDA vendors, and foundries.

Nice to have

  • Experience with advanced packaging technologies such as 2.5D, 3D, or CoWoS.
  • Experience with IR/EM analysis, thermal optimization, signal integrity, or DFT-aware implementation.

Culture & Benefits

  • Work with a world-class engineering team experienced in semiconductor and AI companies.
  • Help shape accelerator architecture and implementation from the earliest product stages.
  • Meaningful equity participation.
  • Medical, dental, and vision coverage.
  • 401(k) and generous paid time off.

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