Process Integration Development Engineer (Semiconductor)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $115,110–$162,500 USD

Company

hirify.global develops semiconductor technology and operates foundry labs supporting technology and process development.

What you will do

• Prepare FIB lamellae and perform advanced TEM characterization of semiconductor nanostructures.
• Use TEM imaging, electron diffraction, strain analysis, EDS, and EELS to support engineering investigations.
• Support fabrication, failure analysis, technology development, process development, and process integration activities.
• Collaborate with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
• Contribute to continuous improvement in high-volume manufacturing environments and improve time-to-information for technology development.

Requirements

• Associate degree with 8 years of relevant experience, bachelor's degree with 4 years, or master's degree with 2 years.
• Hands-on industry experience in FIB sample preparation and transmission electron microscopy preparation and operation.
• Strong experience, innovation, and ownership in FIB and TEM.
• Working knowledge of semiconductor process integration.
• Strong communication skills and the ability to work independently and in teams.
• Ability to work on-site in Hillsboro, Oregon.

Culture & Benefits

• Competitive pay and stock bonuses.
• Health, retirement, and vacation benefits.
• Opportunities to continuously upgrade technical skills and learn new methods, tools, and fields.
• Work in a research and development environment supporting advanced semiconductor manufacturing.