Manager, Process Engineer (Deposition)

Location: Singapore, SGP; Science Park II, moving to Tampines from April 2027. Travel required up to 20% of the time.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.

What you will do

• Lead the development and scaling of next-generation advanced packaging technologies.
• Build process and technology roadmaps for advanced packaging, 3D integration, and semiconductor applications.
• Manage engineers performing hardware characterization and developing methods for complex product systems.
• Resolve complex process engineering issues with key customers and address high-value problems.
• Lead product and technology demonstrations, strategic collaboration, and market share improvement initiatives.

Requirements

• Deep technical expertise in semiconductor thin-film deposition technologies, including PVD, CVD, and/or ALD.
• Strong knowledge of materials engineering, process integration, advanced packaging, TSV, hybrid bonding, and wafer-level packaging.
• Demonstrated supervisory or management experience.
• Outstanding communication and interpersonal skills, including the ability to influence senior management and external stakeholders.
• Problem-solving attitude and a strong quality mindset.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs supporting employees at work and at home.
• Regular employment with full-time working hours.
• Relocation eligible.