6 дней назад
Sr Application Engineer – Sign-Off (ASIC Physical Design)
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Описание вакансии
Текст:
TL;DR
Sr Application Engineer – Sign-Off (ASIC Physical Design): Supporting customer adoption of digital implementation, physical design, and static verification solutions while driving timing, power, signal integrity, and EM/IR sign-off with an accent on advanced technology nodes and PPA optimization. Focus on developing physical design methodologies and flows, closing timing and IR-drop issues, and enabling successful ASIC tapeouts.
Location: Penang, Malaysia
Company
develops electronic design automation solutions and supports semiconductor customers with digital implementation, physical design, and verification technologies.
What you will do
- Support and drive customer adoption of digital implementation, physical design, and static verification solutions.
- Perform timing closure, power and signal integrity sign-off, and EM/IR sign-off.
- Work on low-power and high-speed designs using advanced technology nodes.
- Participate in or lead next-generation physical design methodology and flow development.
- Collaborate with customer design teams, R&D, Product Engineering, and RTL design teams to support successful tapeouts.
Requirements
- BS or MS degree in Electrical Engineering or Computer Science.
- 3+ years of hands-on experience in physical design and verification.
- Experience with ASIC design flows, static timing analysis, and EM/IR analysis.
- Ability to work independently, take ownership of varied technical tasks, and verify, test, and characterize designs.
- Good English communication skills and the ability to work effectively in a team.
Nice to have
- Knowledge of timing and IR-drop closure in 3DIC technologies.
Culture & Benefits
- Opportunity to work on challenging low-power and high-speed semiconductor designs.
- Collaboration with customer engineering, R&D, Product Engineering, and RTL design teams.
- Focus on leadership, innovation, and impactful technology work.
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