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6 дней назад

Sr Application Engineer – Sign-Off (ASIC Physical Design)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr Application Engineer – Sign-Off (ASIC Physical Design): Supporting customer adoption of digital implementation, physical design, and static verification solutions while driving timing, power, signal integrity, and EM/IR sign-off with an accent on advanced technology nodes and PPA optimization. Focus on developing physical design methodologies and flows, closing timing and IR-drop issues, and enabling successful ASIC tapeouts.

Location: Penang, Malaysia

Company

hirify.global develops electronic design automation solutions and supports semiconductor customers with digital implementation, physical design, and verification technologies.

What you will do

  • Support and drive customer adoption of digital implementation, physical design, and static verification solutions.
  • Perform timing closure, power and signal integrity sign-off, and EM/IR sign-off.
  • Work on low-power and high-speed designs using advanced technology nodes.
  • Participate in or lead next-generation physical design methodology and flow development.
  • Collaborate with customer design teams, hirify.global R&D, Product Engineering, and RTL design teams to support successful tapeouts.

Requirements

  • BS or MS degree in Electrical Engineering or Computer Science.
  • 3+ years of hands-on experience in physical design and verification.
  • Experience with ASIC design flows, static timing analysis, and EM/IR analysis.
  • Ability to work independently, take ownership of varied technical tasks, and verify, test, and characterize designs.
  • Good English communication skills and the ability to work effectively in a team.

Nice to have

  • Knowledge of timing and IR-drop closure in 3DIC technologies.

Culture & Benefits

  • Opportunity to work on challenging low-power and high-speed semiconductor designs.
  • Collaboration with customer engineering, R&D, Product Engineering, and RTL design teams.
  • Focus on leadership, innovation, and impactful technology work.

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