TD Media and Collaterals Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $85,200–$120,280 USD

Company

hirify.global's Media Development organization advances assembly packaging technologies and semiconductor manufacturing processes.

What you will do

• Develop and optimize assembly media and collaterals for quality, reliability, cost, yield, and productivity targets.
• Design and implement new media and collateral solutions using Design of Experiments and Statistical Process Control.
• Evaluate media and collaterals under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces.
• Lead initiatives to identify and mitigate quality and reliability risks.
• Provide technical consultation and deliver solutions aligned with operational and technology milestones.
• Document technical improvements and innovations through research papers and presentations.

Requirements

• Bachelor's degree in mechanical engineering or a related field.
• At least 6 months of hands-on experience in equipment engineering, mechanical design, or process engineering.
• Ability to work on-site in Phoenix, Arizona, United States.
• This position is not eligible for hirify.global immigration sponsorship.

Nice to have

• Experience with SolidWorks or AutoCAD.
• A portfolio of self-completed projects from concept through fabrication.
• Familiarity with semiconductor packaging processes and technology.
• Strong technical and analytical skills and experience delivering results on complex, time-critical projects.

Culture & Benefits

• Collaborative environment focused on packaging technology and manufacturing innovation.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Inclusive workplace and ethical hiring practices.