IC Packaging Design Intern

Location: Ottawa, Ontario, Canada

Salary: CAD 26–28.5 per hour

Company

hirify.global develops high-performance optical networking components and platforms for data centers, enterprise networks, wireless infrastructure, and passive optical networks.

What you will do

• Design IC chip carriers for electronic components and pluggable modules.
• Use advanced CAD tools to create high-density circuit layouts with high-speed transmission lines and sensitive power domains.
• Develop physical assembly designs and mechanical outlines.
• Generate layouts that support 3D electromagnetic simulations and thermo-mechanical analysis.
• Work with signal integrity experts and receive mentoring from senior packaging engineers.

Requirements

• Ability to learn quickly and work independently or in a team environment.
• Exposure to CAD tools, including Cadence Allegro, Keysight ADS, AutoCAD, DraftSight, or SolidWorks.
• Basic understanding of frequency analysis and analog electronic circuit fundamentals.
• Interest or experience in advanced electronic manufacturing and tolerance analysis.
• Availability for a 12–16 month student internship, with a desired start date of May 2027.

Culture & Benefits

• Hands-on internship with progressively more complex technical responsibilities.
• Mentoring and guidance from senior packaging engineers and signal integrity specialists.
• Full-time employment with a performance-oriented compensation package.
• Artificial intelligence tools may be used during screening and recruitment, while hiring decisions remain with the hiring team.