Senior SiPh Product Development Engineer (Silicon Photonics)

Location: Hybrid work at an assigned hirify.global site in the United States; primary location in Phoenix, Arizona, with additional locations in Santa Clara, California, and Albuquerque, New Mexico.

Annual salary: $164,470–$232,190 USD, depending on work location, skills, experience, and education.

Company

hirify.global's Integrated Photonics Solutions organization develops advanced optical interconnect technologies based on silicon photonics for high-performance computing and networking.

What you will do

• Lead matrixed teams across design, fabrication, assembly, testing, quality, and operations to execute the product Plan of Record.
• Drive end-to-end development of photonic ICs, electronic ICs, and manufacturing process technologies from concept through production ramp.
• Balance technical tradeoffs, business priorities, cost, schedule, and risk to support product decisions.
• Drive manufacturing readiness through wafer-start planning, qualification strategy, capacity analysis, customer sampling, and assembly/test site certification.
• Identify and mitigate technical and execution risks through contingency planning and cross-functional alignment.
• Communicate product status, risks, and recommendations to stakeholders and leadership while coordinating with fab, optical design, hardware, firmware, IC design, test, operations, and quality teams.

Requirements

• BS in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 6+ years of relevant industry experience, or a Master's degree with 4+ years of relevant industry experience.
• 3+ years of experience in high-speed optical component or product development, silicon photonics, semiconductor fabrication process development, wafer-level assembly or packaging development, or test development and validation.
• Experience with silicon photonics, optical transceivers, or semiconductor product development.
• Strong collaborative leadership, analytical decision-making, proactive communication, and stakeholder management skills.
• Willingness to work in a hybrid model with on-site time at an assigned hirify.global site in the United States.

Nice to have

• 3+ years of semiconductor fab process experience.
• 3+ years of assembly, packaging, or manufacturing process experience.
• Experience leading cross-functional engineering teams and transitioning products from development to high-volume manufacturing.

Culture & Benefits

• Hybrid work model combining on-site and off-site work.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Work across design, manufacturing, engineering, operations, and quality organizations.
• Commitment to ethical hiring and Responsible Business Alliance compliance.