Packaging Module Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $133,800–$188,890 USD

Company

hirify.global develops semiconductor technologies and advanced packaging solutions for computing and mobile applications.

What you will do

• Develop and qualify advanced packaging processes, materials, and equipment for reliability, yield, cost, and high-volume manufacturing targets.
• Design process specifications, prototype workflows, and equipment configurations for emerging packaging technologies.
• Conduct Design of Experiments and analyze process windows and interactions among materials, equipment, and chemistry.
• Drive improvements in process capability, stability, quality, productivity, and equipment performance.
• Collaborate with design, materials, and manufacturing teams to resolve technical challenges.
• Establish material specifications, support suppliers, document technical findings, and standardize qualification procedures.

Requirements

• PhD in a relevant STEM field.
• Analytical problem-solving, attention to detail, initiative, resilience, and effective communication.
• Ability to work collaboratively across technical and manufacturing teams.
• Adaptability and willingness to learn new technologies in a fast-paced environment.

Nice to have

• PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related field.
• 6+ months of experience with Statistical Process Control and Design of Experiments.
• Experience in packaging process development, equipment qualification, process data analysis, and manufacturing equipment evaluation.
• Knowledge of semiconductor device fabrication, packaging process flows, quality systems, process documentation, and manufacturing standards.

Culture & Benefits

• Collaborative, cross-functional engineering environment.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Full-time, first-shift position with on-site work in Arizona.