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9 дней назад

Quality And Reliability Engineer (Advanced Packaging & Assembly)

Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Quality And Reliability Engineer (Advanced Packaging & Assembly) (EMIB/Foveros semiconductor manufacturing): Ensuring quality and reliability across silicon processing, wafer-level assembly, substrates, and advanced packaging with an accent on excursion management, yield improvement, process controls, and thermomechanical risk assessment. Focus on driving root cause analysis, containment and material disposition decisions, statistical quality monitoring, and technology transfer for next-generation manufacturing processes.

Location: Penang, Malaysia; hybrid work model with on-site time at the assigned hirify.global site

Company

hirify.global develops and manufactures semiconductor technologies, including advanced packaging solutions such as EMIB and Foveros.

What you will do

  • Assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications across silicon processing and wafer-level assembly.
  • Lead root cause analysis and corrective and preventive actions using 8D and related problem-solving methodologies.
  • Partner with fab manufacturing, substrate, assembly, test, process engineering, and quality teams to strengthen process controls, in-line screening, and outgoing quality.
  • Manage manufacturing excursions, including MRB facilitation, containment, product risk assessment, discrepant material disposition, and communication with foundry partners and customers.
  • Improve quality systems, control plans, defect Pareto analysis, reliability monitoring, and best-known methods across manufacturing steps.
  • Use data extraction, statistical analysis, and custom scripting to identify product, process, and customer risks while supporting technology certification and transfer.

Requirements

  • Bachelor’s or master’s degree in Materials Science, Physics, Chemical Engineering, Mechanical Engineering, or a related field.
  • At least 3 years of relevant semiconductor manufacturing experience with a bachelor’s degree, including wafer-level assembly, die preparation, or packaging substrates.
  • Experience with quality and reliability methodologies, excursion management, and failure mode analysis.
  • Proficiency with statistics and data analytics tools for quality and reliability assessment, plus familiarity with QnR quality systems and tools.
  • Strong communication, meeting, influencing, learning, and cross-functional collaboration skills.
  • Comfort working across geographies in a diverse environment; travel may be required.

Nice to have

  • Experience influencing organizations toward a quality-focused mindset.
  • Proven ability to manage impactful quality events.

Culture & Benefits

  • Hybrid work model combining on-site and off-site work.
  • Shift 1 schedule in Malaysia.
  • Opportunity to work on EMIB, Foveros, wafer-level assembly, and other next-generation semiconductor manufacturing technologies.
  • Commitment to responsible business practices and ethical hiring; no recruitment, medical examination, or other employment fees are charged.

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