Engineer II (Phicom/Wirebond)

Формат работы

onsite

Тип работы

fulltime

Грейд

middle

Английский

Страна

Malaysia

Вакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:

TL;DR

Engineer II (Phicom/Wirebond) (Semiconductor Manufacturing): Supporting high-volume semiconductor manufacturing through Wire Bond equipment troubleshooting, reliability improvements, qualification, validation, and production ramp activities with an accent on OEE, yield, downtime analysis, and preventive maintenance. Focus on optimizing equipment performance, leading productivity and cost-reduction projects, and solving complex reliability issues across production operations.

Location: Seremban, Malaysia

Company

hirify.global operates a global semiconductor manufacturing environment focused on advanced manufacturing and Wire Bond technologies.

What you will do

Troubleshoot and resolve Wire Bond equipment issues to minimize production downtime.
Drive preventive maintenance, equipment reliability, productivity, and continuous improvement initiatives.
Support equipment qualification, validation, installation, and production ramp activities.
Analyze OEE, yield, MTBF, MTTR, and downtime data to identify improvement opportunities.
Lead equipment optimization, productivity, and cost-reduction projects.
Collaborate with Production, Process Engineering, Quality, Manufacturing Excellence, and Maintenance teams while ensuring safety and quality compliance.

Requirements

Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering, or an equivalent field.
2–5 years of semiconductor manufacturing experience.
Experience supporting Wire Bond equipment in a production environment.
Experience with Wire Bond equipment troubleshooting, root cause analysis, preventive maintenance, reliability improvement, qualification, validation, and production support.
Strong analytical, problem-solving, communication, stakeholder management, and independent working skills.

Nice to have

Experience with ASM, K&S, Shinkawa, Hesse, or similar Wire Bond platforms.
Knowledge of SPC, FMEA, 8D, Lean Manufacturing, or Six Sigma.
Exposure to automation, robotics, or factory integration systems.
Project management, coaching, mentoring, or continuous improvement experience.

Culture & Benefits

Full-time opportunity in a high-volume semiconductor manufacturing environment.
Exposure to advanced manufacturing and Wire Bond technologies.
Career development and growth opportunities.
Competitive compensation and benefits package.
Inclusive and accessible recruitment process with a focus on diversity, safety, and reasonable workplace adjustments.

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