Senior Packaging Integration Lead (Advanced Packaging)

Location: San Jose, California, United States

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for hyperscalers and ecosystem partners.

What you will do

• Own the end-to-end packaging solution for advanced connectivity products from definition and architecture through qualification and production ramp.
• Translate customer packaging, mechanical, thermal, SIPI, and reliability requirements into package architectures, specifications, and execution roadmaps.
• Define package structures and technology selections, including 2.5D/3D integration, chiplets, interposers, CoWoS-class platforms, and organic substrates.
• Define test-vehicle strategies to de-risk packaging technologies, characterize interconnect and SIPI performance, and validate assembly and reliability.
• Align silicon design, package design, thermal, product engineering, test, validation, quality, operations, and business-unit stakeholders.
• Drive technical direction and issue resolution with OSAT, foundry, substrate, and material partners while communicating risks and decisions to customers and executive leadership.

Requirements

• B.S. or M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related discipline; an advanced degree is preferred.
• 5–7+ years of experience in advanced packaging technologies, including 2.5D/3D integration, TSV, chiplets, and interposers.
• End-to-end ownership of product or platform packaging from definition and architecture through qualification and production ramp.
• Experience with package architecture, technology trade-offs, test vehicles, characterization and qualification strategies, and manufacturability.
• Strong architecture-level understanding of SIPI, thermal, and thermo-mechanical reliability considerations.
• Experience working directly with customers, foundries, OSATs, substrate suppliers, and material vendors, including leading without direct authority.

Nice to have

• Experience with optical or co-packaged optics packaging.
• Experience with UCIe, die-to-die interconnect, and high-bandwidth chiplet integration.
• Experience with CoWoS-class, silicon-bridge, or advanced fan-out packaging platforms.
• Experience engaging foundry and OSAT partners on advanced-packaging technology roadmaps.

Culture & Benefits

• Work with globally distributed teams across customers, internal functions, and external manufacturing partners.
• Collaborate in an environment that encourages creativity, innovation, and diverse perspectives.
• Relevant experience is welcomed from people with diverse backgrounds and experiences.