Packaging Lead / Architect (Advanced Packaging)

Location: Penang, Malaysia or Singapore

Company

hirify.global develops Bitcoin mining solutions, ASIC chips, mining rigs, datacenters, and AI cloud capabilities.

What you will do

• Define chip packaging roadmaps and product architectures, including die placement, substrates, interconnects, and power delivery.
• Lead chip–package–board co-design, layout review, routing, manufacturing constraints, design closure, and release.
• Direct signal integrity, power integrity, thermal, and thermomechanical analysis, including models, design budgets, margins, and signoff criteria.
• Coordinate prototype testing, simulation-to-measurement correlation, root-cause analysis, and resolution of electrical, thermal, structural, and reliability issues.
• Manage technical interfaces with foundries, assembly and test partners, and substrate vendors during qualification, yield improvement, and production ramp.
• Recruit and manage packaging design and simulation engineers while establishing design reviews, documentation, reusable models, and engineering processes.

Requirements

• Bachelor’s degree or higher in electrical engineering, microelectronics, materials, mechanical engineering, or a related field.
• 10+ years of relevant chip packaging design or development experience.
• Ownership of at least one complex packaging project from architecture through validation and volume production.
• Knowledge of flip-chip/FC-BGA, substrate design, materials, assembly processes, high-speed interconnects, power delivery, cooling, and reliability.
• Hands-on expertise in package design, signal integrity, power integrity, thermal, or thermomechanical analysis, with experience guiding multidisciplinary signoff.
• Team leadership, cross-functional collaboration, supplier technical management, EDA/simulation tools, and effective technical communication and documentation in English.

Nice to have

• Advanced 2.5D/3D packaging experience involving chiplets, heterogeneous integration, interposers, RDL, TSVs, microbumps, or hybrid bonding.
• Experience with CPUs, GPUs, switch chips, high-performance ASICs, or large and high-power packages.
• Familiarity with advanced packaging and substrate supply chains.

Culture & Benefits

• Inclusive environment that values authenticity and diverse perspectives.
• Start-up-oriented environment with opportunities to work with industry pioneers.
• Opportunity to contribute to digital asset industry projects and new systems.
• Autonomy, personal accountability, fast growth, and learning opportunities.
• Welfare benefits, training, and mentoring.