SMTS Photonics Advanced Packaging Integration (Silicon Photonics)

Location: Essex Junction, Vermont, USA

Salary: $107,400–$204,500 annually

Company

hirify.global is a semiconductor foundry providing design, development, fabrication, advanced packaging, and photonics services for technology companies.

What you will do

• Define, design, and qualify optical packaging architectures for silicon photonics modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop scalable fiber-to-chip coupling strategies such as V-groove, passive alignment, and lens integration for high-density optical I/O.
• Drive heterogeneous integration of photonic and electronic components using 2.5D, 3D, and 3.5D packaging technologies.
• Run thermal, mechanical, and optical multiphysics simulations to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and failure-analysis tools.
• Support OSAT collaboration, manufacturing transfer, mass-production readiness, cost modeling, and technical roadmap communication.

Requirements

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or a related field.
• At least 5 years of semiconductor packaging experience focused on photonic or advanced packaging.
• Hands-on experience with fiber attach, photonic alignment, optical coupling, die attach, flip-chip, underfill, molding, or micro-optics integration.
• Knowledge of optical-module reliability standards and qualification methodologies.
• Experience bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Nice to have

• Experience with automated optical/electro-optical test setups and motion-control systems, including Python-based systems.
• Knowledge of co-packaged optics, pluggable modules, and silicon photonics ecosystems.
• Experience with thermal/mechanical modeling and optical simulation tools such as Lumerical or COMSOL.
• Familiarity with the GF Fotonix platform and advanced packaging flows.
• Experience working with OSATs, external development partners, and cross-functional technical teams.

Culture & Benefits

• Work within an advanced packaging and photonics center supporting AI, HPC, and data-center applications.
• Collaborate with photonics, electrical, mechanical, manufacturing, OSAT, and external partner teams.
• Support environmental, health, safety, and security programs.
• Employment is subject to applicable pre-employment conditions and workplace accommodation processes.