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9 дней назад

Sr. Technician - Failure Analysis (Semiconductor)

48 200 - 83 200$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr. Technician - Failure Analysis (Semiconductor): Preparing semiconductor samples for TEM using FIB tools and supporting high-volume manufacturing, yield learning, and root-cause investigations with an accent on precision sample preparation, materials characterization, and laboratory equipment operation. Focus on developing FIB-based analytical methods, solving failure-analysis challenges, and maintaining sample quality, documentation, and cleanroom safety.

Location: Essex Junction, Vermont, United States; onsite in Fab 9 and the analytical laboratory

Salary: $48,200–$83,200 per year

Company

hirify.global provides semiconductor design, development, and fabrication services through a global manufacturing footprint.

What you will do

  • Prepare semiconductor samples for Transmission Electron Microscopy using Focused Ion Beam tools and precision preparation techniques.
  • Operate and maintain FIB equipment for TEM lamella preparation and site-specific cross-sectioning.
  • Execute preparation plans with TEM engineers and ensure sample quality, dimensional accuracy, and documentation.
  • Track work in laboratory information management systems and improve sample preparation methods and workflows.
  • Support yield, reliability, technology, and root-cause investigations in collaboration with engineers and laboratory staff.
  • Perform basic equipment troubleshooting, preventive maintenance, and cleanroom activities while following safety requirements.

Requirements

  • Associate’s degree in engineering, physics, materials science, electronics, semiconductor manufacturing, chemistry, mathematics, or a related technical discipline, or equivalent military technical training.
  • At least 2–3 years of relevant technical laboratory, manufacturing, machining, microscopy, or semiconductor industry experience.
  • Experience supporting failure analysis, materials characterization, process development, or sample preparation such as polishing, sectioning, thinning, mounting, or metallographic preparation.
  • Strong mechanical aptitude, attention to detail, problem-solving, organization, and ability to operate complex analytical equipment.
  • Fluent English communication skills are required.
  • Ability to lift up to 30 pounds periodically, work for extended periods with laboratory equipment, and wear required PPE.

Nice to have

  • Experience with Focused Ion Beam systems or related precision material removal tools.
  • Experience in a semiconductor fab, cleanroom, analytical laboratory, or manufacturing environment.
  • Familiarity with semiconductor device structures, processing concepts, microscopes, imaging systems, or analytical instrumentation.
  • Experience documenting technical work and managing multiple requests while maintaining quality standards.

Culture & Benefits

  • Full-time employment supporting semiconductor manufacturing and technology investigations.
  • Training and development in advanced FIB-based sample preparation and failure analysis techniques.
  • Work alongside experienced engineers and laboratory staff.
  • Focus on safety, quality, teamwork, and continuous improvement.
  • The role may require obtaining a U.S. Department of Defense Security Clearance during employment.

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