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8 дней назад

Low Yield Analysis Engineer on Shift (Semiconductor)

99 030 - 139 810$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Low Yield Analysis Engineer on Shift (Semiconductor): Analyzing wafer-level and package assembly failures to determine root causes of electrical yield loss, with an accent on hands-on laboratory testing, defect characterization, and failure analysis. Focus on developing innovative failure-identification techniques, analyzing electrical and material defects, and driving corrective actions across engineering and manufacturing teams.

Location: On-site in Hillsboro, Oregon, United States; shift-based role.

Annual salary: $99,030–$139,810 USD.

Company

hirify.global develops semiconductor technologies and supports package assembly, wafer-level assembly, sorting, and testing operations.

What you will do

  • Analyze in-line electrical failures, yield losses, and package or wafer-level assembly defects to determine root causes.
  • Design, test, check out, modify, and characterize wafer-level assembly technologies.
  • Conduct hands-on laboratory work, define data acquisition and analysis plans, and recommend corrective actions.
  • Develop failure-analysis techniques, best-known methods, and approaches that accelerate failure identification.
  • Provide consultation on packaging, assembly problems, and manufacturing-process improvements.
  • Coordinate with engineering technicians, shift engineers, module partners, yield and integration teams, suppliers, and customers.

Requirements

  • Bachelor’s degree with at least 2 years of experience, or a master’s degree, in materials science and engineering, mechanical engineering, chemical engineering, electrical engineering, chemistry, physics, or a related field.
  • Ability to work on-site in Hillsboro, Oregon, in a shift-based laboratory role.
  • Strong analytical, problem-solving, communication, and presentation skills.
  • Ability to work effectively across organizational boundaries and adapt to changing priorities and working hours.
  • Ability to communicate technical findings verbally and through reports.

Nice to have

  • Laboratory experience and experience with cross-sectioning, delayering, SEM, X-ray, microscopy, CSAM, ion milling, TEM, or FIB.
  • Experience with electrical fault isolation and failure-analysis methods such as hand probing, curve tracing, auto probing, TDR, EOTPR, EBAC, RIDR, or ELITE.
  • Experience with EDX, AFM, FTIR, Raman, XRD, or EBSD.
  • Knowledge of package or die mapping software such as Mentor Graphics, SysNav/CadNav, or FIELD.
  • SQL scripting and basic statistical analysis tools such as JMP.

Culture & Benefits

  • Collaborative work with engineers, engineering technicians, internal teams, external suppliers, and customers.
  • Competitive compensation with stock bonuses.
  • Health, retirement, and vacation benefits.
  • Fast-paced technical environment with changing priorities and cross-functional responsibilities.

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